MCOTI Technology Co., Ltd.

Generally compared with acrylic adhesive and polyurethane adhesive, thermally conductive epoxy adhesive has outstanding performance in volume strength and bonding strength, which largely overcomes the lack of mechanical strength of other materials, especially organic silicone materials, and is more suitable for stable operation in rotation, torsion, and strong vibration environments. However, as the operating temperature of devices such as power modules, high-frequency transformers, sensors, and electric heating elements continues to rise, the requirements for thermal conductivity and heat dissipation continue to increase, and the defects of ordinary epoxy adhesives in thermal conductivity and high temperature resistance are gradually emerging.

The performance of thermally conductive epoxy adhesive currently used for fixed bonding of thermosensitive devices, power devices, etc. on the market is either low in thermal conductivity or insufficient in bonding strength, which is very limited in applications that require both thermal conductivity and structural bonding. EW6628M combines the characteristics of thermal conductivity and structural bonding, optimizes viscosity and adhesive performance, and directly makes two-component products into double-tube packaging, meeting customers' needs for easy use and efficient production.

Epoxy thermal conductive structural adhesive is suitable for insulation and thermal conductive bonding of electronic PCBs, power modules, high-frequency transformers, connectors, sensors, electric heating elements and circuit boards.